Thermal transfer devices, temperature stabilized containers including the same, and related methods

ABSTRACT

Generally, this disclosure relates to a temperature-stabilized and/or temperature-controlled storage container. In an embodiment, the storage container may include e a temperature-control regulator or assembly that may control the temperature in the interior space of the temperature-stabilized storage container.

If an Application Data Sheet (ADS) has been filed on the filing date ofthis application, it is incorporated by reference herein. Anyapplications claimed on the ADS for priority under 35 U.S.C. §§119, 120,121, or 365(c), and any and all parent, grandparent, great-grandparent,etc. applications of such applications, are also incorporated byreference, including any priority claims made in those applications andany material incorporated by reference, to the extent such subjectmatter is not inconsistent herewith.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of the earliest availableeffective filing date(s) from the following listed application(s) (the“Priority Applications”), if any, listed below (e.g., claims earliestavailable priority dates for other than provisional patent applicationsor claims benefits under 35 USC §119(e) for provisional patentapplications, for any and all parent, grandparent, great-grandparent,etc. applications of the Priority Application(s)).

Priority Applications

None.

BACKGROUND

Temperature-control devices and systems can maintain internal storageregion(s) at a suitable temperature for various products that may besensitive to temperature. For example, temperature-sensitive productsmay degrade or fail if the temperature thereof increases above an upperthreshold temperature or falls below a lower threshold temperature. Somemedicines, such as vaccines, may become unusable if held at, above, orbelow a selected temperature for a selected period of time. Accordingly,manufacturers and users of temperature-control devices and systemscontinue to seek improvements thereto.

SUMMARY

Generally, the present disclosure relates to a temperature-stabilized ortemperature-controlled storage containers and thermal transfer devicesfor use with such storage containers. In an embodiment, the storagecontainer can include a temperature-control regulator or assembly thatcan control the temperature in an interior space of thetemperature-stabilized storage container. For example, the temperaturecontrol unit can cool the interior space of the storage container to asuitable or selected temperature or temperature range and maintain theselected or suitable temperature therein. As such, thetemperature-controlled storage container may maintain suitabletemperature of temperature-sensitive items stored therein (e.g.,medicine, vacines, food, etc.).

An embodiment includes a thermal transfer device for a storagecontainer. The thermal transfer device includes a housing having a topplate, a first pillar extending from the top plate, and a second pillarextending from the top plate. The thermal transfer device also includesat least one phase change material (PCM) container containing at leastone first PCM and being configured to be positioned in thermalcommunication with the first pillar of the housing. Moreover, thethermal transfer device includes at least one PCM carrier containing atleast one second PCM and being configured to be positioned in thermalcommunication with one or more of the first pillar or the second pillar.The thermal transfer device further includes a heat pipe having a firstthermal end thereof in thermal communication with one or more of the topplate, the first pillar, or the second pillar.

An embodiment includes a temperature-stabilized container having atleast one first wall defining a storage space and at least one secondwall spaced outwardly from the at least one first wall and defining aninsulation space therebetween. The temperature-stabilized containerfurther includes a thermal transfer device that includes a first portionpositioned inside the storage space, and a second portion positionedoutside the storage space. The thermal transfer device includes ahousing including, a top plate, a first pillar extending from the topplate, and a second pillar extending from the top plate. The firstpillar and the second pillar are positioned inside the storage space.The thermal transfer device also includes at least one PCM carriercontaining at least one second PCM and being in thermal communicationwith one or more of the first pillar or the second pillar. The at leastone PCM container and the least one PCM carrier are positioned insidethe storage space. Moreover, the thermal transfer device includes a heatpipe having a first thermal end thereof in thermal communication withone or more of the top plate, the first pillar, or the second pillar.

An embodiment includes a method of maintaining a temperature in a closedstorage space. The method includes providing a temperature-stabilizedcontainer that includes a shell defining a storage space and a thermaltransfer device positioned inside the storage space. The thermaltransfer device includes a top plate, a first pillar extending from thetop plate, and a second pillar extending from the top plate. The firstpillar and the second pillar are positioned inside the storage space. Inaddition, the temperature-stabilized container includes at least one PCMcontainer containing at least one first PCM and being in thermalcommunication with the first pillar of the housing, and at least one PCMcarrier containing at least one second PCM and being in thermalcommunication with one or more of the first pillar or the second pillar.The at least one PCM container and the at least one PCM carrier arepositioned inside the storage space

The thermal transfer device also includes a heat pipe having a firstthermal end thereof in thermal communication with one or more of the topplate, the first pillar or the second pillar. The method furtherincludes removing heat from the storage space by cooling a secondthermal end of the heat pipe to produce heat transfer from the at leastone first PCM and the at least one second PCM to the second end of heatpipe.

Features from any of the disclosed embodiments may be used incombination with one another, without limitation. In addition, otherfeatures and advantages of the present disclosure will become apparentto those of ordinary skill in the art through consideration of thefollowing detailed description and the accompanying drawings. Theforegoing summary is illustrative only and is not intended to be in anyway limiting.

In addition to the illustrative aspects, embodiments, and featuresdescribed above, further aspects, embodiments, and features will becomeapparent by reference to the drawings and the following detaileddescription.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an isometric view of a temperature-stabilized storagecontainer, according to an embodiment;

FIG. 2 is an isometric, cutaway view of the temperature-stabilizedstorage container of FIG. 1;

FIG. 3 is an exploded, isometric view of a removable cooling element,according to an embodiment;

FIG. 4 is an isometric view of a partial cooling assembly and a thermalhousing, according to an embodiment;

FIG. 5A is an isometric view of the thermal housing of FIG. 4;

FIG. 5B is an enlarged, isometric view of a portion of the thermalhousing shown in FIG. 4;

FIG. 6 is an exploded, isometric view of a thermal housing, according toan embodiment;

FIG. 7A is an isometric, cutaway view of a temperature-stabilizedstorage container, according to an embodiment;

FIG. 7B is an isometric, cutaway view of the temperature-stabilizedstorage container of FIG. 7A; and

FIG. 8 is a partial, isometric view of a cooling unit, according to anembodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof. In the drawings,similar symbols typically identify similar components, unless contextdictates otherwise. The illustrative embodiments described in thedetailed description, drawings, and claims are not meant to be limiting.Other embodiments may be utilized, and other changes may be made,without departing from the spirit or scope of the subject matterpresented here.

Generally, the present disclosure relates to a temperature-stabilized ortemperature-controlled storage container. In an embodiment, the storagecontainer can include a temperature-control regulator or assembly thatmay control the temperature in an interior space of thetemperature-stabilized storage container. For example, the temperaturecontrol unit can cool the interior space of the storage container to asuitable or selected temperature or maintain the selected or suitabletemperature therein. As such, the temperature-controlled storage maymaintain suitable temperature of temperature-sensitive items storedtherein (e.g., medicine, food, etc.).

Moreover, in an embodiment, the temperature control regulator may haveone or more removable temperature-control elements, such as coolingelements (e.g., one or more removable PCM containers, such as 1, 2, 3,4, etc., removable PCM containers). For example, a cooling unit orelement may be removable from the temperature-control unit. In someoperating conditions, the removable cooling element(s) may be placedinto another container to maintain a temperature-controlled environmenttherein. For example, the removable cooling elements may be placed intoa transfer container (e.g., that may be smaller than the storagecontainer or may be used to temporarily store or transfertemperature-sensitive items located or stored in the storage container).

Generally, a storage container may have any suitable size, shape,configuration, etc. FIG. 1 is an isometric view of atemperature-stabilized storage container 100, according to anembodiment. For example, the temperature-stabilized storage container100 may have an outer wall or shell 110 defining the exterior of thetemperature-stabilized storage container 100. As described below in moredetail, the shell 110 also may define an interior space of thetemperature-stabilized storage container 100 (e.g., one or moretemperature-sensitive items, such as medicine, etc., may be stored inthe interior space of the temperature-stabilized storage container 100).Hence, for example, the interior space of the temperature-stabilizedstorage container 100 may be accessible to place temperature-sensitiveitems or products therein or to remove items therefrom. For example, theshape, size, and general configuration of the shell 110 of thetemperature-stabilized storage container 100 may be similar to thestorage container described in U.S. Patent Application Publication No.2014/0150464, entitled “Temperature-Stabilized Storage Systems WithIntegral Regulated Cooling,” the entire content of which is incorporatedherein by reference. Moreover, as described below in more detail, thetemperature-stabilized storage container 100 may include a coolingassembly 160 and cooling unit 170, which may remove heat from theinterior space of the shell 110 or may control temperature therein. Inthe illustrated embodiment, the shell 110 has a substantiallycylindrical shape or circular cross-sectional shape. More specifically,for example, the shell 110 may have three sections that collectivelydefine or form the shell 110. In an embodiment, the shell 110 may havean upper section 111, an intermediate section 112, and a lower section113. The lower section 113 may define or form the bottom of the shell110 of the interior space inside the shell 110. Hence, for example, thelower section 113 may have a substantially cylindrical peripheral walland a bottom wall (not visible) connected to or extending from theperipheral wall. For example, the lower section 113 can have a radius orfillet that can connect the peripheral wall to the bottom wall of thelower section 113.

The intermediate section 112 can extend from and can be connected to orintegrated with the lower section 113. In an embodiment, theintermediate section 112 can be generally cylindrical and can beconnected to or integrated with the substantially cylindrical peripheralwall of the lower section 113 (e.g., the diameter of the intermediatesection 112 can be similar to or the same as the diameter of thecylindrical peripheral wall of the lower section 113). For example, theintermediate section 112 can be removably connected to the lower section113 (e.g., via a snap fit, press-fit, or any number of suitableconnections).

In an embodiment the upper section 111 can be connected to or integratedwith the intermediate section 112. For example, the upper section 111can have substantially cylindrical lower and upper portions (e.g., thelower cylindrical portion can have a diameter that is similar to or thesame as the diameter of the intermediate section 112). In any event, theintermediate section 112 and the upper section 111 can be connectedtogether. For example, the upper section 111 can be removably connectedto the intermediate section 112 (e.g., in the same manner as the lowersection 113, as described above)

Also, in an embodiment, the cooling assembly 160 of thetemperature-stabilized storage container 100 can include a cover 161that can enclose or protect one or more elements or components of thecooling assembly 160. For example, the cover 161 can connect to theupper section 111. In an embodiment, the upper portion of the uppersection 111 can have shape and size that are similar to the shape andsize of the cover 161 (e.g., the upper section of the upper section 111can be generally cylindrical and can have the same or similar diameteras the diameter of the cover 161, which, for example, can be smallerthan the diameter of the lower section of the upper section 111). In anembodiment, the upper section 111 can include a fillet or transitionradius extending between and connecting the upper and lower portions ofthe upper section 111.

As noted above, the upper section 111 can be removable from theintermediate section 112. In particular, for example, the upper section111 can be removed from the intermediate section 112 together with thecover 161 and the cooling assembly 160, thereby removing elements orcomponents of the cooling assembly 160 that are positioned in theinterior space of the shell 110 or removing temperature-sensitive itemsstored inside the thermally-stabilized storage container 100.

In an embodiment, the cooling unit 170 can include a housing 171 thatcan enclose or protect one or more elements or components of the coolingunit 170, as described below in more detail. Generally, the housing 171can have any suitable shape which can vary from one embodiment to thenext and can depend on the shape, size, arrangement, etc., of theelements or components of the cooling unit 170 enclosed therein. In anembodiment, the cover 161 can be connected to (e.g., removably) orintegrated with the housing 171. In an embodiment, thetemperature-stabilized storage container 100 can include an electroniccontroller 200 that can control the operation of one or more elementsand/or components of the cooling assembly 160 and/or of the cooling unit170, as described below in more detail. For example, the controller 200can be at least partially housed in the housing 171 of the cooling unit170

As described above, the temperature-stabilized storage container 100 caninclude a temperature regulator or assembly that can cool the interiorspace of the temperature-stabilized storage container 100 or maintainthe temperature in the interior space at a selected or suitabletemperature. FIG. 2 is an isometric, cutaway view of thetemperature-stabilized storage container 100, which exposes externalelements and components thereof. As shown in FIG. 2, in an embodiment,the temperature-stabilized storage container 100 can include atemperature-control assembly 120, a portion of which can heat or coolinterior space 10 of the temperature-stabilized storage container 100.For example, the temperature-control assembly 120 can include one ormore removable cooling elements, such as removable cooling elements 130.

Furthermore, in an embodiment, the temperature-control assembly 120 caninclude fixed (e.g., permanently or semi-permanently) cooling elements,such as the fixed cooling elements that can contain a PCM or PCMcontainers 140 (e.g., fixed PCM containers 140 a, PCM containers 140 b).For example, the fixed PCM containers 140 a, 140 b can be similar or thesame as one another. In an embodiment, the PCM container 140 a can havea generally mirrored configuration of the PCM container 140 b, asdescribed below in more detail. It should be appreciated, however, thatin some embodiments, the temperature-stabilized storage container 100can have only removable cooling elements, such as the removable coolingelements 130.

In an embodiment, the removable cooling elements 130 or PCM containers140 can include one or more PCMB. For example, the removable coolingelements 130 can be a PCM carrier that includes one or more PCMcontainers with a first PCM material. Generally, the PCM can be anymaterial that can be cooled to change from a first phase to a secondphase (e.g., from a liquid phase to a solid phase) and can subsequentlyabsorb heat to change back from the second phase to the first phase(e.g., from a solid phase to a liquid phase).

For example, the PCM can have a freezing temperature between about 0° C.to about 2° C. In some embodiments, the PCM has a freezing temperaturebetween about 1° C. to about 3° C. In some embodiments, PCM has afreezing temperature between about 2° C. to about 4° C. In someembodiments, PCM has a freezing temperature between about 3° C. to about5° C. In some embodiments, the PCM has a freezing temperature betweenabout 4° C. to about 6° C. In an embodiment, the PCM can be or caninclude water or ice.

In an embodiment, the PCM can be stored in one or more containers thatcan be included in the removable cooling elements 130 or the PCMcontainers 140. As the PCM changes from the first phase to the secondphase and vice versa, the volume occupied by the PCM in the container(s)can change (e.g., the volume of the PCM in a solid phase can be greaterthan in a liquid phase or vice versa). In some embodiments, the PCMcontainer(s) include a PCM as well as expansion space sufficient toinclude the PCM in a different phase. For example, the container(s)containing PCM can include suitable space to accommodate expansion andcontraction of the PCM after the change of the phase thereof, such thatwhen the PCM has the largest operating volume (e.g., largest volumeproduced during operation of the temperature-stabilized storagecontainer 100), the container(s) remain undamaged or undeformed.

As described below in more detail, the removable cooling elements 130can include PCM containers 135 that can contain the first PCM.Generally, the PCM containers 135 can include or comprise any suitablematerial (e.g., thermoplastic material, such a polypropylene,polyethylene, etc., metal, such as aluminum, an aluminum alloy, brass,bronze, copper, copper alloys, or steel, etc.). In any event, theremovable cooling elements 130 can include or be formed of a materialhaving a suitable coefficient of thermal conductivity, such that theheat in the interior space 10 can be transferred to the PCM in the PCMcontainers 135 at a suitable rate.

Similarly, the PCM containers 140 can include a second PCM. In anembodiment, the second PCM can be similar to or the same as the firstPCM. For example, the second PCM and the first PCM can have a similar orthe same melting point or heat capacity. Alternatively, the second PCMcan be different from the first PCM (e.g., the second PCM can have adifferent melting point or heat capacity than the first PCM). Moreover,the PCM containers 140 can include or be formed of a similar or the samematerial as the PCM containers 135. Alternatively, the PCM containers140 can include or be formed of a different material than the materialof PCM containers 140. For example, the material of the PCM containers140 can have a different heat transfer coefficient than the material ofthe PCM containers 135 (e.g., the material of the PCM containers 140 canhave a higher heat transfer coefficient than the material of PCMmaterial 131, such that the PCM containers 140 can transfer heat fastfrom the interior space 10 to the PCM than the removable coolingelements 130, or vice versa).

In an embodiment, the temperature-control assembly 120 includes ahousing sized and configured to secure the removable cooling elements130 and PCM containers 140. In particular, for example, thetemperature-control assembly 120 can include a thermal housing 150 thatcan removably secure the removable cooling elements 130 therein andfixedly secure PCM containers 140. Moreover, the thermal housing 150 canbe in thermal communication with a cooling assembly 160 that can removeheat from the thermal housing 150, which can be transferred thereto fromthe removable cooling elements 130 or PCM containers 140.

In an embodiment, the thermal housing 150 can include one or more slots,such as slot 151, which can accommodate or secure the removable coolingelements 130 therein. For example, the removable cooling elements 130can be removably positioned in the slot 151, such that the removablecooling elements 130 or the corresponding PCM containers 135 therein arein thermal communication with the thermal housing 150, and the heat fromthe removable cooling elements 130 can be transferred to the thermalhousing 150 and to the cooling assembly 160 (e.g., to maintain the PCMin a selected phase or to reduce the amount of PCM changing from onephase to another, while maintaining the temperature in the interiorspace 10 at a suitable or selected temperature level). In an embodiment,the removable cooling elements 130 can slide into the slot 151 and canhave sliding fit therein, and one or more surfaces or areas of theremovable cooling elements 130 can contact one or more areas or surfacesof the thermal housing 150, such as one or more surfaces inside the slot151. For example, the removable cooling elements 130 can have a handle139 (FIG. 3) and can have a sliding fit with the slot 151, such that auser can remove the removable cooling elements 130 from the thermalhousing 150 by pulling on the handle 139.

In an embodiment, friction between the removable cooling elements 130and the walls or surfaces defining the slots, such as the slot 151 cansuitably retain or secure the removable cooling elements 130 in the slot(e.g., in the slot 151). Additionally or alternatively, the thermalhousing 150 or the removable cooling elements 130 can include one ormore fastening mechanisms, which can suitably secure the removablecooling elements 130 in the slots (e.g., in the slot 151). For example,as described below in more detail, the thermal housing 150 can includeor be formed of any number of suitable materials (e.g., materialssuitable for transferring heat from the removable cooling elements 130and the PCM containers 140 to a location outside of the interior space10). In an embodiment, the thermal housing 150 can include or be formedof one or more ferromagnetic steel portions, and the removable coolingelements 130 can include one or more magnets (e.g., rare earth magnets)connectable to the corresponding steel portions, thereby removablysecuring the removable cooling elements 130 to the thermal housing 150.

According to an embodiment, the PCM containers 140 can be in thermalcommunication with the thermal housing 150 and can be fixedly securedthereto. For example, the PCM containers 140 can have one or moresurfaces or areas thereof in contact with one or more surfaces or areasof the thermal housing 150. As described below in more detail, the PCMcontainers 140 can be secured to the thermal housing 150 (e.g., the PCMcontainers 140 can be fastened to the thermal housing 150). In any case,the PCM containers 140 can absorb heat from the interior space 10 of thetemperature-stabilized storage container 100 (e.g., the PCM in the PCMcontainers 140 absorb heat from the interior space 10), and the thermalhousing 150 can transfer heat from the PCM containers 140 to the coolingassembly 160, thereby maintaining the PCM in the PCM containers 140 in aselected phase or reducing the amount of the PCM in the PCM containers140 that can change from one phase to another).

Generally, the cooling assembly 160 can have any number of suitableconfigurations. In an embodiment, the cooling assembly 160 includes aheat pipe that is in thermal communication with the thermal housing 150(e.g., a hot end of the heat pipe can be in thermal communication withthe thermal housing 150) and a cooling unit 170 can be in thermalcommunication with a cold end of the heat pipe. The heat pipe can haveany suitable size and configuration or any suitable working fluid (e.g.,the working fluid can depend based on the operating temperatures of thecold or hot ends of the heat pipe, ambient temperature, coolingdevice(s) connected to the hot end of the heat pipe, etc.). In anembodiment, the temperature-stabilized storage container 100 can includeinsulation 180 that can at least partially enclose or insulate the heatpipe, thereby reducing heat transfer from the surrounding environment tothe heat pipe along the length thereof.

Moreover, the cooling assembly 160 can include a shroud or a cover 161(see also FIG. 1) that can at least partially enclose or protect theinsulation 180 and the heat pipe (e.g., from surrounding environment,from heat, etc.). In an embodiment, the cover 161 can connect to theshell 110 in a manner that seals the interior space 10 of the shell 110at the bottom of the cover 161. For example, the cover 161 can be sizedand configured to connect to the shell 110, such that the exterior orperipheries thereof seal the interior space 10. Additionally oralternatively, the cover 161 can have a generally closed bottom that canseal the interior space 10 of the shell 110. For example, the cover 161can include an opening in the bottom that allows the heat pipe to passinto the interior space of the cover 161, where the heat pipe isenclosed by the insulation 180; otherwise, the bottom of the cover 161can be closed and can seal the interior space 10 of the shell 110.

The cooling unit 170 can be in thermal communication with the cold endof the heat pipe and can transfer heat therefrom. As discussed below inmore detail, in an embodiment, the cooling unit 170 can use ambientfluid, such as air, to cool the cold end of the heat pipe. Alternativelyor additionally, the cooling unit 170 can include one or morethermoelectric units (e.g., Peltier cells) that can at least partiallycool the cold end of the heat pipe. For example, the thermoelectricunits can be coupled to the heat pipe in a manner that thethermoelectric units operate as thermoelectric coolers and cool the coldend of the heat pipe.

In an embodiment, the cooling unit 170 can include a unit housing 171(FIG. 1) that can enclose or protect one or more elements or componentsof the cooling unit 170. For example, the cooling unit 170 can includeone or more heat sinks or thermoelectric cooler that can be housed in orat least partially enclosed by the housing 171.

FIG. 3 is an isometric, disassembled view of the removable coolingelement 130, according to an embodiment. In particular, for example asshown in FIG. 3, the removable cooling elements 130 can include one ormore compartments such as two compartments 131, 132 defined by anexterior shell or wall 133 and by one or more interior dividers or walls134. Moreover, the removable cooling elements 130 can include PCMcontainers 135 (e.g., PCM containers 135 a, 135 b) that can be removablypositioned in the corresponding first and second. compartments 131, 132.As described above, the removable cooling element 130 or the PCMcontainers 135 can be removed from the storage container or can be usedto maintain a suitable temperature in a temporary container theremovable cooling elements 130 can be removed from the thermal housing,and the PCM container 135 can be removed from the first and secondcompartments 131, 132 of the removable cooling elements 130 and placedinto the temporary container).

Generally, the compartments 131, 132 and the corresponding PCMcontainers 135 a, 135 b can have any suitable shape, such that the PCMcontainers 135 a, 135 b can fit inside the corresponding compartments131, 132. In an embodiment, the removable cooling elements 130 caninclude one or more slots or openings extending through the exteriorwall(s) 133, which can accommodate removal of the 135 from thecorresponding compartments 131, 132. For example, a back wall of theexterior walls 133 can have openings 136 extending therethrough; the PCMcontainers 135 can be pushed out of the first and second compartments131, 132. Additionally or alternatively, at least one of the exteriorwalls 133, such as one or more peripheral walls, can have slotsextending therethrough (e.g., slots 137 or 138). For example, a tool canbe inserted through one or more of the slots 137, 138 and between thewall(s) 133 and the one or more of the PCM containers 135, and a forcecan be applied to the 135 to push the PCM containers 135 out of thecorresponding first or second compartments 131, 132.

Again, the removable cooling elements 130 can be removed from thethermal housing. In an embodiment, the removable cooling elements 130can include one or more handles, such as handle 139, attached or securedto at least one of the exterior walls 133. For example, the handle 139can be a flexible handle (e.g., a rope or a band) that can fold toreduce the size thereof inside the interior space of the storagecontainer and can be expanded to facilitate grasping thereof (e.g., topull the removable cooling elements 130 out of the thermal housing 150).

FIG. 4 shows the thermal housing 150 and PCM containers 140 outside ofthe storage container. For example, as mentioned above, a heat pipe 190,which can be at least partially surrounded by the insulation 180, can bein thermal communication with the thermal housing 150. In particular,the hot end of the heat pipe 190 can be in thermal communication withand can transfer heat from the thermal housing 150, thereby cooling thePCM containers 140 and the PCM carriers that are in thermalcommunication with the thermal housing 150. The insulation 180 can haveany size or shape as can be suitable for enclosing or insulating theheat pipe 190.

As mentioned above, the thermal housing 150 includes slot 151 that canaccommodate a removable cooling elements, such as PCM carrier. Moreover,the thermal housing 150 can include a similar slot 152 that canaccommodate another PCM carrier. According to an embodiment, the slots151, 152 are defined by a center pillar 153 and opposing pillars 154 and155. In particular, the slot 151 can be defined by and between thecenter pillar 153 and a first side pillar 154, and the slot 152 can bedefined by and between the center pillar 153 and the second side pillar155. Hence, for example, one or more portions or surfaces of the PCMcarrier positioned in the slot 151 can be in contact or in thermalcommunication with the center pillar 153 and with the first side pillar154 and thereby can transfer heat therefrom (e.g., from the PCM) to thethermal housing 150. Also, one or more portions or surfaces of the PCMcarrier positioned in the slot 152 can be in contact or in thermalcommunication with the center pillar 153 or with the second side pillar155 and thereby can transfer heat therefrom (e.g., from the PCM) to thethermal housing 150.

It should be appreciated that the thermal housing 150 can have anynumber of slots or pillars that can define the corresponding slots andthe configurations thereof can vary from one embodiment the next. Hence,the terms “center” and “side” pillars are used for convenience ofdescription and should not be interpreted as limiting the scope of thisdisclosure. Also, in an embodiment, the center pillar 153, the firstside pillar 154, the second side pillar 155, or combinations thereof canbe generally plate-like or can have a generally flat shape (e.g., any ofthe center pillar 153, first side pillar 154, and second side pillar 155can have generally planar opposing major surface separated by a suitabledistance defining respective thicknesses thereof). Alternatively, any ofthe center pillar 153, first side pillar 154, and second side pillar 155can have any number of other suitable configurations, such as rod ortubular-shaped configurations, bar-shaped configuration, grid orscaffolding-shaped configuration, etc.

Moreover, in an embodiment, the thermal housing 150 can include one ormore plates that can secure together the pillars (e.g., the centerpillar 153, the first side pillar 154, the second side pillar 155, orcombinations thereof) or can provide structural rigidity to the thermalhousing 150. For example the thermal housing 150 can include a top plate156 that can be connected or secured to one or more of the center pillar153, the first side pillar 154, or the second side pillar 155.Additionally or alternatively, the thermal housing 150 can include abase plate 157 that can be connected or secured to the center pillar153, the first side pillar 154, or the second side pillar 155. Forexample, the center pillar 153, the first side pillar 154, the secondside pillar 155, the top plate 156, and the base plate 157 can beconnected together and can collectively form or define the thermalhousing 150 or provide structural rigidity thereto.

Generally, the center pillar 153, the first side pillar 154, the secondside pillar 155, the top plate 156, and the base plate 157 can have anynumber of suitable sizes, shapes, and configurations. For example, thecenter pillar 153, the first side pillar 154, the second side pillar155, the top plate 156, and the base plate 157 are substantially planar(e.g., such as to removably accommodate corresponding PCM carriers inthe slots 151, 152). For example, the top plate can be substantiallypositioned in or oriented along a first plane, and the center pillar 153can be substantially positioned in or oriented along a second plane thatcan be substantially perpendicular to the first plane (e.g., tocorrespond to the shape of the PCM carriers positionable in the firstand second slots 151, 152). However, in other embodiments, the centerpillar 153, the first side pillar 154, the second side pillar 155, thetop plate 156, and the base plate 157 can be nonplanar.

In an embodiment, the first or second side pillars 154, 155 can besubstantially positioned in or oriented along respective second andthird planes. For example, the second and third planes can besubstantially perpendicular to the first plane. Moreover, the second andthird planes can be substantially parallel to each other.

The thermal housing 150 also can include a substantially planar baseplate 157 that can be substantially positioned in or oriented along afourth plane, which can be substantially parallel to the first plane orsubstantially perpendicular to the second and third planes. It should beappreciated that, as noted above, any of the center pillar 153, thefirst side pillar 154, the second side pillar 155, the top plate 156,and the base plate 157 can have any number of suitable shapes orconfigurations, which can vary from one embodiment to another. Moreover,relative positions or orientations of the center pillar 153, the firstside pillar 154, the second side pillar 155, the top plate 156, and thebase plate 157 can vary from one embodiment to the next and can beconfigured such as to accommodate the removable cooling elements 130 orPCM containers 140 generally in a manner described herein.

In an embodiment, the PCM containers 140 can be in thermal communicationwith the thermal housing 150. For example, the PCM container 140 a canbe in thermal communication with the first side pillar 154 to therebytransfer heat therefrom (e.g., from the PCM) to the thermal housing 150.Similarly, the PCM container 140 b can be in thermal communication withthe second side pillar 155 and thereby can transfer heat therefrom(e.g., from the PCM) to the thermal housing 150. As described above, inan embodiment, the PCM containers 140 can be fastened or otherwisesecured to the thermal housing 150 (e.g., fastening the PCM containers140 to the thermal housing 150 can provide suitable contact betweensurfaces thereof, which can provide a suitable thermal connection orreduce thermal resistance therebetween).

Furthermore, in an embodiment, one or more of the PCM containers 140 a,140 b can include respective panels 140 a′, 140 b′. For example, theplates 140 a′, 140 b′ can facilitate positioning the PCM containers 140a, 140 b relative to the respective first and second side pillars 154,155 (e.g., back sides of the panels 140 a′, 140 b′ can abut front edges(or minor sides) of the respective first and second side pillars 154,155, such as to position the PCM containers 140 a, 140 b relativethereto (e.g., such that the cam locks 141 a (described below in moredetail) align with corresponding channels 158, 159 to secure the PCMcontainers 140 a, 140 b to the respective first and second side pillars154, 155). Additionally or alternatively, the plates 140 a′, 140 b′ caninclude an angled portion (e.g., front faces or sides thereof can beangled at non-parallel angles relative to the back sides, as shown inFIG. 4). For example, the angled portions of the plates 140 a′, 140 b′can facilitate insertion of the removable cooling elements, such as PCMcarriers, into the slots 151, 152.

FIGS. 5A and 5B illustrate a connection between the PCM container 140 aand the thermal housing 150 according to an embodiment. Morespecifically, FIG. 5B is an enlarged, isometric view that shows theconnection between the PCM container 140 a and thermal housing 150, asindicated in FIG. 5A. In an embodiment, the PCM container 140 a caninclude cam locks 141 a that can be positioned in corresponding channels158 in the first side pillar 154 (the panel 140 a′ (FIG. 4) is removedto better illustrate the cam locks 141 a). More specifically, forexample, the cam locks 141 a can be piovotable about an axis 142 a, in amanner that pivoting the cam locks 141 a about the axis 142 a secures orlocks the PCM container 140 a to the first side pillar 154. For example,the cam locks 141 a can be spring-loaded, such that pivoting the camlocks 141 a to a locked position (e.g., as shown in FIGS. 5A-5B) pressesthe cam locks 141 a against the first side pillar 154, thereby pullingor forcing together the PCM container 140 a and the first side pillar154.

Conversely, pivoting the cam locks 141 into an unlocked positionreleases the cam locks 141 a and the PCM container 140 a from the firstside pillar 154, such that the PCM container 140 a can be removed orpulled away from the first side pillar 154. It should be appreciatedthat the thermal housing 150 and the PCM container 140 a can beinitially assembled together and then placed or positioned in theinterior space of the thermally-stabilized storage container. Hence, insome embodiments, to remove the PCM container 140 a or the PCMcontainers 140 b (FIG. 4) from the thermal housing 150, the PCMcontainer 140 a. 140 b together with the thermal housing 150 are removedfrom the thermally-stabilized storage container, such that the PCMcontainer 140 a, 140 b can be unlocked and pulled away from the thermalhousing 150, after removal from the interior space of thethermally-stabilized storage container.

Moreover, the PCM containers, such as the PCM storage container 140 a,can have any number of suitable shapes or sizes. In an embodiment, outerperipheral surface(s) of the PCM container 140 a can be positioned nearor can approximate or correspond to the shape of the wall defining theinterior space of the thermally-stabilized storage container. In theillustrated embodiment, a portion of the PCM container 140 a is definedby an arcuate peripheral wall 143 a. In some embodiments, the interiorspace of the thermally-stabilized storage container can be substantiallycylindrical or can have a substantially circular cross-section. Hence,for example, the arcuate peripheral wall 143 a of the PCM container 140a can be positioned near or in contact with an inner surface of a walldefining the interior space of the storage container (e.g., suchconfiguration can optimize or maximize the amount of PCM that the PCMcontainers 140 can contain therein). In alternative or additionalembodiments, the interior space of the storage container can have anysuitable shape, such as generally prismoid shape (e.g., having one ormore planar walls that define the interior space), and the PCM container140 a can have one or more planar walls or surfaces that can bepositioned near corresponding walls or surfaces of the storage containeror can approximate the shape thereof.

Again, the center pillar 153, the first side pillar 154, the second sidepillar 155, the top plate 156, and the base plate 157 can have anynumber of suitable sizes, shapes, and configurations. Moreover, thecenter pillar 153, the first side pillar 154, the second side pillar155, the top plate 156, and the base plate 157 can connect together withany number of suitable connection elements or components (e.g.,fasteners, weld, braze, solder, etc.). In an embodiment, the top plate156 or the base pate 157 can include one or more orientation orpositioning features that can facilitate alignment of the center pillar153, the first side pillar 154, the second side pillar 155, orcombinations thereof relative to one another or relative to the topplate 156 or the base pate 157. For example, the top plate 156 caninclude cutouts 156′, 156″ that can accept portions of the respectivefirst side pillar 154 and second side pillar 155 therein (e.g., suchthat a portion of the first side pillar 154 and the second side pillar155 is coplanar with the upper surface of the top plate 156).

In an embodiment, a portion of the first side pillar 154 or the secondside pillar 155 can be angled or tapered. For example, tapered portionsof the respective first and second side pillars 154, 155 can facilitateaccess to the cam lock 141 a for locking and unlocking the PCMcontainers, such as PCM container 140 a, relative to the thermal housing150. Additionally or alternatively, the tapered portions of therespective first and second pillars 154, 155 can facilitate insertion ofthe removable cooling elements, such as PCM carriers. As shown in FIG.6, tapered portion 154′ of the first side pillar 154 can include cutouts154 a′, 154 b′ that provide access to the cam lock 141 a that lock thePCM containers to the thermal housing 150 in the manner described above.For example a finger or a tool can be inserted through the cutouts 154a′ or 154 b′and positioned between the first side pillar 154 and the camlock 141 a, such as to apply force to the cam lock 141 a and pivot thecam lock 141 a away from the inner surface of the first side pillar 154,thereby unlocking the cam lock 141 a from the first side pillar 154.

As mentioned above, any of the PCM containers 140 a, 140 b can besecured to the respective first and second side pillars 154, 155 withany number of suitable mechanisms and/or connections that can facilitatea suitable contact between the surfaces thereof for heat transfertherebetween. For example, the PCM containers 140 a, 140 b can besecured to the respective first and second side pillars 154. 155 withone or more wedge locks, dovetails or t-shaped elements securable bytightenable gibs, bolts, snap-fitting connectors, or magneticconnectors, etc. In an embodiment, the PCM containers 140 a, 140 b canbe bolted to the respective first and second side pillars 154, 155 withone or more bolts from the inside of the PCM containers 140 a, 140 band/or from inside the respective slots 151, 152. Moreover, as describedabove, the PCM containers 140 a, 140 b and the first and second sidepillars 154, 155 can be positioned inside a shell of thetemperature-stabilized storage container. In an embodiment, the shellcan include a resilient material that can press or force together thethe PCM containers 140 a, 140 b and the first and second side pillars154, 155, thereby securing the PCM containers 140 a, 140 b to therespective first and second side pillars 154, 155. Furthermore, thetemperature-stabilized storage container can include one or moreelements that can press or force together the PCM containers 140 a, 140b and the first and second side pillars 154, 155. For example, thetemperature-stabilized container can include a tightenable band that canforce together the PCM containers 140 a, 140 b and the first and secondside pillars 154, 155.

Generally, the tapered portion 154′ can be connected to or integratedwith substantially planar or flat portions of the first and second sidepillars. For example, the tapered portion 154′ can be removably fastenedto flat portion 154″ of the first side pillar 154. Alternatively, thefirst side pillar 154 or the second side pillar 155 can be fabricatedentirely from a solid or unitary piece of material.

As mentioned above, the hot end of the heat pipe 190 can be in thermalcommunication with the thermal housing 150. In an embodiment, the heatpipe 190 can be in thermal communication with the center column pillar153 that in turn can be in direct or indirect thermal communication withother portions of the thermal housing 150 (e.g., with the top plate 156,base plate 157, first side pillar 154, second side pillar 155,combinations thereof). In any event, during operation, the heat pipe 190transfers heat from the thermal housing 150.

In an embodiment, the heat pipe 190 can be positioned in the centerpillar 153 and can extend therein toward or to the base plate 157. Forexample, the center pillar 153 can include portions 153′, 153″ that canbe connected together, which can sandwich the heat pipe 190therebetween. In an embodiment, the heat pipe 190 has a generallycircular cross-sectional shape, and the portions 153′, 153″ can includegroves suitably sized and shaped to position the heat pipe 190 thereinor in contact therewith. For example, the portions 153′, 153″ can havegenerally arcuate or semi-circular grooves that can together form atubular opening or a hollow cylinder sized and shaped to fit about theheat pipe 190. In an embodiment, the heat pipe 190 can have tight orpress fit with the grooves of the portions 153′, 153″, such as toprovide a suitable surface-to-surface contact between the heat pipe 190and center pillar 153.

As shown in FIG. 6, the hot end of the heat pipe 190 can be positionednear or in contact with the base plate 157 of the thermal housing 150.Alternatively, the heat pipe 190 can terminate at the hot end thereof atany suitable location along at the thermal housing 150 (e.g., along alongitude of the thermal housing 150). For example, the hot end of theheat pipe 190 can be in direct contact or thermal communication with thetop plate 156. In the illustrated embodiment, the top plate 156 includesan opening 156 a, and the heat pipe 190 can pass through the opening 156a and into the groove in the thermal housing 150.

As mentioned above, the heat pipe 190 can have any number of suitableconfigurations (e.g., cross-sectional shapes, sizes, working fluids,etc.). In an embodiment, the heat pipe 190 can include one or morebends, such as bends 191, 192, which can reorient one or more portionsof the heat pipe 190. For example, the heat pipe 190 can extendgenerally linearly inside the thermal housing 150. In an embodiment, thebends 191 and 192 can reposition a portion of the heat pipe 190 relativeto the portion thereof inside the thermal housing 150, such that therepositioned portion extends at an offset location from the portioninside the thermal housing 150. Hence, for example, the hot and hot endsof the heat pipe 190 can be misaligned relative to each other (e.g.,positioned at an offset from a straight line). For example, offsettingthe hot and hot ends of the heat pipe 190 (relative to a straight line)can facilitate placement or positioning of one or more cooling unitsthat can be in thermal communication with the cold end of the heat pipe190.

In an embodiment, the change in direction or orientation of the heatpipe 190 can be made as the heat pipe 190 passes through the top plate156. For example, the opening 156 a can be size or shaped to accommodatea portion of the heat pipe 190 passing therethrough at an oblique angle(e.g., relative to a top surface of the top plate 156). It should beappreciated that the heat pipe 190 can include or comprise any number ofsuitable materials (e.g., malleable materials) that can be bent withoutdamaging the structural integrity of the heat pipe 190 or withoutbreaking the heat pipe 190. For example, the heat pipe 190 can includeor can comprise copper, aluminum, steel, etc.

As described above, the cooling assembly (including the heat pipe 190)can cool the thermal housing 150 as well as the PCM located in thecontainers that are in thermal communication with the thermal housing150, thereby maintaining the PCM in the same phase or reducing theamount of PCM changing phase from one to another. In any case, accordingto an embodiment, a cooling assembly (e.g., which includes the heat pipe190) can be in thermal communication with the thermal housing 150 andcan remove heat therefrom. More specifically, for example, a coolingunit can cool the cold end of the heat pipe 190 and, thereby,maintaining the hot end of the heat pipe 190 at a suitable or selectedtemperature, such that the heat pipe 190 can remove or transfer heatfrom the thermal housing 150.

FIGS. 7A and 7B illustrate the cooling unit 170, according to anembodiment. In particular, FIG. 7A shows an isometric, cutaway view ofthe housing 171 of the cooling unit 170, such that the elements orcomponents that can be enclosed in the housing 171 are visible. FIG. 7Bshows the cooling unit 170 with the housing 171 removed to provide abetter view of the elements or components located inside the housing171. As shown in FIGS. 7A and 7B, the heat pipe 190 can be in thermalcommunication with a thermoelectric unit or cooler 172. Morespecifically, the thermoelectric cooler 172 (e.g., Peltier cell) canhave a cold side 172 a thermally coupled to the cold end of the heatpipe 190, thereby cooling the cold end of the heat pipe 190. Moreover,the cooling unit 170 can include a hot side 172 b, which can be cooledto produce a suitable or selected temperature at the cold side 172 a orto produce a suitable heat transfer rate from the cold end of the heatpipe 190 and, thereby, from the interior space of the storage container.

In an embodiment, the hot side 172 b of the thermoelectric cooler 172can be thermally coupled to one or more heat sinks, such as heat sinks173 a, 173 b. Generally, heat sink(s) can be thermally coupled to thehot side thermoelectric cooler 172 b in any number of suitablearrangements or configurations suitable for cooling the hot side 172 b.In the illustrated embodiment, the heat sinks 173 a, 173 b can bethermally coupled to the hot side 172 b with respective heat pipes 174a, 174 b. In other words, the hot end of the heat pipe 174 a can be inthermal communication with or thermally coupled to the hot side 172 b ofthe thermoelectric cooler 172, and the cold end of the heat pipe 174 acan be in thermal communication with or thermally coupled to the heatsink 173 a. Similarly, the hot end of the heat pipe 174 b can be inthermal communication with or thermally coupled to the hot side 172 a ofthe thermoelectric cooler 172, and the cold end of the heat pipe 174 bcan be in thermal communication with or thermally coupled to the heatsink 173 b. Again, it should be appreciated that, while the illustratedembodiment shows two heat sinks, this disclosure is not so limited, andany suitable number of heat sinks can be thermally coupled to the hotside 172 b of the thermoelectric cooler 172 (e.g., one, three, four,etc.).

It should be appreciated that the cold end of the heat pipe 190 can becooled by any number of thermoelectric coolers, which can be connectedto any number of heat pipes to further dissipate heat from the hot sidesthereof. For example, the heat pipe can be in thermal communication witha connector block that is sized and configured to secure multiplethermoelectric coolers. In an embodiment, the connector block can have agenerally triangular cross-sectional shape (e.g., at a cross-sectionperpendicular to longitudinal axis 20), and two thermoelectric coolerscan be secured to and in thermal communication with two of the faces ofthe connector block. It should be appreciated that increasing the numberof thermoelectric cooler can reduce the temperature difference betweenthe hot and cold sides thereof (e.g., that can be produced duringcooling of the cold end of the heat pipe 190), which can increaseefficiency of the thermoelectric coolers.

It should be appreciated that the temperature-stabilized storagecontainer can include any suitable cooling device, which can vary fromone embodiment to another. For example, the temperature-stabilizedstorage container can include a heat pump (e.g., vapor compression), asolar-desiccant-evaporative cooler, among others.

The heat sinks can have any suitable configuration or arrangement, whichcan vary from one embodiment to the next. FIG. 8 shows the heat sinks173 a, 173 b configured and arranged according to at least oneembodiment. For example, the heat sinks 173 a, 173 b can includerespective heat exchangers 175 a, 175 b (e.g., passive heat exchangers)that can dissipate heat therefrom to surrounding medium that is incontact with the fins thereof (e.g., to ambient air). More specifically,as described above, heat from the cold ends of the respective heat pipes174 a, 174 b can be transferred to the heat exchangers 175 a, 175 b,which can, subsequently, dissipate or transfer the heat to thesurrounding medium. Again, the heat pipes 174 a, 174 b can transfer heatfrom the hot side 172 b of the thermoelectric cooler 172; the cold sideof the thermoelectric cooler 172 can cool the cold end of the heat pipe190.

In an embodiment, the heat sinks 173 a, 173 b can include one or morefans, such as fans 176 a, 176 b), which can force the surrounding medium(e.g., air) to flow across the fins of the heat exchangers 175 a, 175 b.For example, the fans 176 a, 176 b can force flow of air upward or awayfrom the heat exchangers 175 a, 175 b, thereby drawing ambient air belowthe heat exchangers 175 a, 175 b to pass therethrough. Alternatively,the fans 176 a, 176 b can force flow of air downward or toward the heatexchangers 175 a, 175 b. Moreover, the fans 176 a, 176 b can bepositioned above or below the heat exchangers 175 a, 175 b, and the heatsinks 173 a, 173 b can have any suitable number of fans.

Alternatively, however, the heat exchangers 175 a, 175 b of the heatsinks 173 a, 173 b can be cooled by a natural flow of the surroundingmedium, such as air. For example, as the air surrounding the fins of theheat exchangers 175 a, 175 b can have a lower temperature than the fins;as the air is heated by the fins, the heated air will rise and draw incooler or ambient air, and this process can be continuous (e.g., theprocess can continue so long as the ambient air is cooler than thetemperature of the heat exchangers 175 a, 175 b).

As shown in FIG. 8, the heat pipes 174 a, 174 b can extend substantiallyin a plane that is perpendicular relative to a longitudinal direction(e.g., substantially perpendicular to a longitudinal axis 20 that can begenerally aligned with the heat pipe 190). In an embodiment, the heatpipes 174 a, 174 b can be offset longitudinally relative to each other(e.g., along a longitudinal axis 20 that can be generally aligned withthe heat pipe 190). For example, the heat pipe 174 a can belongitudinally lower than the heat pipe 174 b. Under some operatingconditions, longitudinally offsetting the heat pipes 174 a, 174 brelative to each other can position the hot ends thereof at differentportions of the hot side 172 b of the thermoelectric cooler 172, therebyproviding a more uniform heat transfer from or cooling of the hot side172 b (e.g., as compared with heat pipes that can be connected to thehot side at the same longitudinal position). Moreover, in an embodiment,the heat sinks 173 a, 173 b can be longitudinally offset from eachother, as shown in FIG. 8.

It should be appreciated that the heat pipes 174 a, 174 b can dissipateheat to any suitable heat sinks. For example, heat sinks can include aPCM in thermal communication with the respective cold ends of the heatpipes 174 a, 174 b. For example, the PCM can have a freezing point atabout the temperature of the outside environment during one or moreperiods of time (e.g., in the evening or after sundown, such as at about40-50° F., for example at about 44°F). Under some operating conditions,for example, the PCM can freeze after sundown and can be melted duringoperation of the temperature-stabilized storage container, by absorbingheat at the cold ends of the heat pipes 174 a, 174 b. For example, thePCM can be in one or more containers thermally connected to the coldends of the heat pipes 174 a, 174 b.

As mentioned above, the temperature in the internal space of the storagecontainer can be maintained at a suitable or selected temperature levelor within a suitable or selected temperature range (e.g., for a suitabletime period). More specifically, for example, the electronic controller200 that includes control electrical circuitry can be coupled to thethermoelectric cooler 172 and can control or direct operation thereof.In an embodiment, the control electrical circuitry can activateoperation of the thermoelectric cooler 172 or can control (directly orindirectly) the voltage applied to the thermoelectric cooler 172,thereby controlling the amount of heat transfer from the internal spaceof the storage container. Additionally or alternatively, the controller200 can be coupled to one or more of the heat sinks 173 a, 173 b (e.g.,to the fans 176 a, 176 b).

Generally, the controller 200 can include a processor, memory, storage,and input/output (I/O) interface. The controller 200 can be configuredor programed to perform one or more acts or steps as described herein.It should be also appreciated that the controller 200 can be or caninclude a general purpose computer that can be programmed or can includeinstructions to perform the acts described herein. Additionally oralternatively, the controller 200 can be configured as a special purposecontroller 200 (e.g., the controller 200 can include programmable fieldgate arrays (PFGA) that can be programmed or configured, such that thecontroller 200 can perform the acts described herein).

As described above, a storage container can include one or more PCMcontainers positioned inside the interior space thereof. For example,substantially all of the PCM in the PCM containers can be initially in afirst phase (e.g., in a solid phase). Moreover, under some operatingconditions, the temperature inside the interior space of the storagecontainer can be approximately the same as the temperature of the PCM inthe PCM containers. When the storage is exposed to environment having atemperature above the temperature of the PCM, the heat from theenvironment can be transferred to the medium (e,g., air) in the interiorspace of the storage container and to the PCM in the PCM containers. Asthe heat is transferred to the PCM in the PCM containers, under someoperating conditions, at least some of the PCM can undergo a phasechange (e.g., changing from a solid phase to a liquid phase).

The controller 200 can be operably coupled to one or more sensors thatcan detect temperature inside the interior space of the storagecontainer, the temperature of the PCM inside the PCM container(s),volume of the PCM in one or more of the PCM containers, combinations ofthe foregoing, etc. The controller 200 can receive one or more signalsfrom the one or more sensors and can operate (directly or indirectly)the thermoelectric cooler 172 or the fans 176 a, 176 b at leastpartially based on the one or more signals received from the one or moresensors. In an embodiment, the controller 200 can include or can beconnected to a database or a lookup table that can include one or morevalues for temperatures or temperature ranges for the PCM in the PCMcontainer(s), volumes or volume ranges of the PCM in one or more of thePCM containers, change in volume of the PCM (which can be determined bythe controller 200 by comparing signals or readings of the volumereceived from the sensors at different times), etc., which can becorrelated with operating schedules or conditions for the thermoelectriccooler 172 or for the fans 176 a, 176 b.

For example, when the volume of the PCM in the PCM containers changesbeyond a threshold value (e.g., increases or decreases beyond thethreshold value), the controller 200 can activate operation of thethermoelectric cooler 172. Alternatively, the controller 200 cancontinuously operate the thermoelectric cooler 172, such as to maintainthe volume of the PCM or the temperature thereof at a suitable orselected level.

Generally, the power to the controller 200 or other elements orcomponents of the thermally-stable storage container (e.g., to thethermoelectric cooler 172, to the fans 176 a, 176 b, etc.) can besupplied from any suitable source. In an embodiment, the storagecontainer can include a battery (e.g., a rechargeable battery) that cansupply suitable power to the elements or components of the controller200. Alternatively or additionally, the elements or component of thestorage container, which require electrical power, can be coupled to amain electrical line (e.g., at a power outlet). In any case, electricalpower can be supplied to the elements or component of the storagecontainer that require electrical power (e.g., the electrical power canbe supplied intermittently).

The memory also can include instructions regarding priority or hierarchyof power needs. In other words, when the power received from the powersource is insufficient to power all elements or components connected atthe power output connection, the processor can use the priorityinstructions to direct the power management unit to provide power toelements or components indicated as having priority over other elementsor components. For instance, the processor can give priority toproviding power to the controller 200 over the thermoelectric unit. Inan embodiment, the priority hierarchy can be as follows, listed fromhighest to lowest: controller 200 (or battery attached to the controller200, if any); thermoelectric unit of the heat sink unit, fan for theheat sink unit (if any); display unit (if any).

The state of the art has progressed to the point where there is littledistinction left between hardware, software (e.g., a high-level computerprogram serving as a hardware specification), and/or firmwareimplementations of aspects of systems; the use of hardware, software,and/or firmware is generally (but not always, in that in certaincontexts the choice between hardware and software can becomesignificant) a design choice representing cost vs. efficiency tradeoffs.There are various vehicles by which processes and/or systems and/orother technologies described herein can be effected (e.g., hardware,software (e.g., a high-level computer program serving as a hardwarespecification), and/or firmware), and that the preferred vehicle willvary with the context in which the processes and/or systems and/or othertechnologies are deployed. For example, if an implementer determinesthat speed and accuracy are paramount, the implementer may opt for amainly hardware and/or firmware vehicle; alternatively, if flexibilityis paramount, the implementer may opt for a mainly software (e.g., ahigh-level computer program serving as a hardware specification)implementation; or, yet again alternatively, the implementer may opt forsome combination of hardware, software (e.g., a high-level computerprogram serving as a hardware specification), and/or firmware in one ormore machines, compositions of matter, and articles of manufacture,limited to patentable subject matter under 35 U.S.C. §101. Hence, thereare several possible vehicles by which the processes and/or devicesand/or other technologies described herein may be effected, none ofwhich is inherently superior to the other in that any vehicle to beutilized is a choice dependent upon the context in which the vehiclewill be deployed and the specific concerns (e.g., speed, flexibility, orpredictability) of the implementer, any of which may vary.

In some implementations described herein, logic and similarimplementations may include computer programs or other controlstructures. Electronic circuitry, for example, may have one or morepaths of electrical current constructed and arranged to implementvarious functions as described herein. In some implementations, one ormore media may be configured to bear a device-detectable implementationwhen such media hold or transmit device detectable instructions operableto perform as described herein. In some variants, for example,implementations may include an update or modification of existingsoftware (e.g., a high-level computer program serving as a hardwarespecification) or firmware, or of gate arrays or programmable hardware,such as by performing a reception of or a transmission of one or moreinstructions in relation to one or more operations described herein.Alternatively or additionally, in some variants, an implementation mayinclude special-purpose hardware, software (e.g., a high-level computerprogram serving as a hardware specification), firmware components,and/or general-purpose components executing or otherwise invokingspecial-purpose components. Specifications or other implementations maybe transmitted by one or more instances of tangible transmission mediaas described herein, optionally by packet transmission or otherwise bypassing through distributed media at various times.

Alternatively or additionally, implementations may include executing aspecial-purpose instruction sequence or invoking circuitry for enabling,triggering, coordinating, requesting, or otherwise causing one or moreoccurrences of virtually any functional operation described herein. Insome variants, operational or other logical descriptions herein may beexpressed as source code and compiled or otherwise invoked as anexecutable instruction sequence. In some contexts, for example,implementations may be provided, in whole or in part, by source code,such as C++, or other code sequences. In other implementations, sourceor other code implementation, using commercially available and/ortechniques in the art, may be compiled/implemented/translated/convertedinto a high-level descriptor language (e.g., initially implementingdescribed technologies in C or C++ programming language and thereafterconverting the programming language implementation into alogic-synthesizable language implementation, a hardware descriptionlanguage implementation, a hardware design simulation implementation,and/or other such similar mode(s) of expression). For example, some orall of a logical expression (e.g., computer programming languageimplementation) may be manifested as a Verilog-type hardware description(e.g., via Hardware Description Language (HDL) and/or Very High SpeedIntegrated Circuit Hardware Descriptor Language (VHDL)) or othercircuitry model which may then be used to create a physicalimplementation having hardware (e.g., an Application Specific IntegratedCircuit).

The foregoing detailed description has set forth various embodiments ofthe devices and/or processes via the use of block diagrams, flowcharts,and/or examples. Insofar as such block diagrams, flowcharts, and/orexamples contain one or more functions and/or operations, it will beunderstood that each function and/or operation within such blockdiagrams, flowcharts, to or examples can be implemented individuallyand/or collectively, by a wide range of hardware, software (e.g., ahigh-level computer program serving as a hardware specification),firmware, or virtually any combination thereof, limited to patentablesubject matter under 35 U.S.C. 101. In an embodiment, several portionsof the subject matter described herein may be implemented viaApplication Specific Integrated Circuits (ASICs), Field ProgrammableGate Arrays (FPGAs), digital signal processors (DSPs), or otherintegrated formats. However, some aspects of the embodiments disclosedherein, in whole or in part, can be equivalently implemented inintegrated circuits, as one or more computer programs running on one ormore computers (e.g., as one or more programs running on one or morecomputer systems), as one or more programs running on one or moreprocessors (e.g., as one or more programs running on one or moremicroprocessors), as firmware, or as virtually any combination thereoflimited to patentable subject matter under 35 U.S.C. 101, and thatdesigning the circuitry and/or writing the code for the software (e.g.,a high-level computer program serving as a hardware specification) andor firmware would be well within the skill of one of skill in the art inlight of this disclosure. The mechanisms of the subject matter describedherein are capable of being distributed as a program product in avariety of forms, and that an illustrative embodiment of the subjectmatter described herein applies regardless of the particular type ofsignal bearing medium used to actually carry out the distribution.Examples of a signal bearing medium include, but are not limited to, thefollowing: a recordable type medium such as a floppy disk, a hard diskdrive, a Compact Disc (CD), a Digital Video Disk (DVD), a digital tape,a computer memory, etc.; and a transmission type medium such as adigital and/or an analog communication medium (e.g., a fiber opticcable, a waveguide, a wired communications link, a wirelesscommunication link (e.g., transmitter, receiver, transmission logic,reception logic, etc.), etc.).

In a general sense, the various aspects described herein which can beimplemented, individually and/or collectively, by a wide range ofhardware, software (e.g., a high-level computer program serving as ahardware specification), firmware, and/or any combination thereof can beviewed as being composed of various types of “electrical circuitry.”Consequently, as used herein “electrical circuitry” includes, but is notlimited to, electrical circuitry having at least one discrete electricalcircuit, electrical circuitry having at least one integrated circuit,electrical circuitry having at least one application specific integratedcircuit, electrical circuitry forming a general purpose computing deviceconfigured by a computer program (e.g., a general purpose computerconfigured by a computer program which at least partially carries outprocesses and/or devices described herein, or a microprocessorconfigured by a computer program which at least partially carries outprocesses and/or devices described herein), electrical circuitry forminga memory device (e.g., forms of memory (e.g., random access, flash, readonly, etc.), and/or electrical circuitry forming a communications device(e.g., a modem, communications switch, optical-electrical equipment,etc.). The subject matter described herein may be implemented in ananalog or digital fashion or some combination thereof.

The herein described subject matter sometimes illustrates differentcomponents contained within, or connected with, different othercomponents. It is to be understood that such depicted architectures aremerely exemplary, and that in fact many other architectures may beimplemented which achieve the same functionality. In a conceptual sense,any arrangement of components to achieve the same functionality iseffectively “associated” such that the desired functionality isachieved. Hence, any two components herein combined to achieve aparticular functionality can be seen as “associated with” each othersuch that the desired functionality is achieved, irrespective ofarchitectures or intermedial components. Likewise, any two components soassociated can also be viewed as being “operably connected”, or“operably coupled,” to each other to achieve the desired functionality,and any two components capable of being so associated can also be viewedas being “operably couplable,” to each other to achieve the desiredfunctionality. Specific examples of operably couplable include but arenot limited to physically mateable and/or physically interactingcomponents, and/or wirelessly interactable, and/or wirelesslyinteracting components, and/or logically interacting, and/or logicallyinteractable components.

In some instances, one or more components may be referred to herein as“configured to,” “configured by,” “configurable to,” “operable/operativeto,” “adapted/adaptable,” “able to,” “conformable/conformed to,” etc.Those skilled in the art will recognize that such terms (e.g.“configured to”) generally encompass active-state components and/orinactive-state components and/or standby-state components, unlesscontext requires otherwise.

The herein described components (e.g., operations), devices, objects,and the discussion accompanying them are used as examples for the sakeof conceptual clarity and that various to configuration modificationsare contemplated. Consequently, as used herein, the specific exemplarsset forth and the accompanying discussion are intended to berepresentative of their more general classes. In general, use of anyspecific exemplar is intended to be representative of its class, and thenon-inclusion of specific components (e.g., operations), devices, andobjects should not be taken limiting.

All of the above U.S. patents, U.S. patent application publications,U.S. patent applications, foreign patents, foreign patent applicationsand non-patent publications referred to in this specification and/orlisted in any Application Data Sheet, are incorporated herein byreference, to the extent not inconsistent herewith.

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purposes ofillustration and are not intended to be limiting, with the true scopeand spirit being indicated by the following claims.

What is claimed is:
 1. A thermal transfer device for a storagecontainer, the thermal transfer device comprising: a housing including,a top plate; a first pillar extending from the top plate; and a secondpillar extending from the top plate; at least one phase change material(PCM) container containing at least one first PCM and being configuredto be positioned in thermal communication with the first pillar of thehousing; at least one PCM carrier containing at least one second PCM andbeing configured to be positioned in thermal communication with one ormore of the first pillar or the second pillar; and a heat pipe having afirst thermal end thereof in thermal communication with one or more ofthe top plate, the first pillar, or the second pillar.
 2. The thermaltransfer device of claim 1, further including a base plate spaced fromthe top plate and from which the first and second pillars extend.
 3. Thethermal transfer device of claim 2, wherein the base plate is attachedto the first and second pillars and positioned generally opposite to thetop plate.
 4. The thermal transfer device of claim 1, wherein the secondpillar includes a first pillar portion and a second pillar portionconnected together.
 5. The thermal transfer device of claim 4, whereinthe heat pipe is positioned between and secured in thermal communicationto the first and second pillar portions.
 6. The thermal transfer deviceof claim 1, wherein the heat pipe includes a second thermal end inthermal communication with one or more of a cooling unit or a heatingunit.
 7. The thermal transfer device of claim 6, wherein the secondthermal end of the heat pipe is in thermal communication with athermoelectric cooler (TEC) configured to cool the second thermal end ofthe heat pipe.
 8. The thermal transfer device of claim 7, wherein theTEC includes a cold side in thermal communication with the second end ofthe heat pipe and a hot side in thermal communication with one or moresecondary heat pipes at first thermal ends thereof.
 9. The thermaltransfer device of claim 7, further including an electronic controlleroperably coupled to the TEC and configured to control operation of theTEC.
 10. The thermal transfer device of claim 8, wherein the one or moresecondary heat pipes include second ends in thermal communication withone or more heat sinks.
 11. The thermal transfer device of claim 10,further including one or more fans positioned to produce fluid flowacross the one or more heat sinks.
 12. The thermal transfer device ofclaim 1, wherein the at least one first PCM is substantial the same asthe at least one second PCM.
 13. The thermal transfer device of claim 1,wherein the at least one first PCM is different from the at least onesecond PCM.
 14. The thermal transfer device of claim 1, wherein the atleast one PCM container is fastenable to the first pillar.
 15. Thethermal transfer device of claim 14, wherein the at least one PCMcontainer includes one or more pivotable locks, the first pillarincludes one or more cutouts sized and positioned to acceptcorresponding ones of the one or more pivotable locks in a manner thatpivoting of the one or more pivotable locks fastens or unfastens the atleast one PCM container relative to the first pillar.
 16. The thermaltransfer device of claim 1, wherein the housing further includes a thirdpillar extending from the top plate and positioned substantially in aplane that is substantially parallel to the first and second pillars,the second pillar being positioned between the first pillar and thethird panel.
 17. The thermal transfer device of claim 16, wherein the atleast one first PCM includes first and second PCM portions, and whereinthe at least one PCM container includes a first PCM container containingthe first PCM portion in thermal communication with the first pillar anda second PCM container containing the second PCM portion in thermalcommunication with the third pillar.
 18. The thermal transfer device ofclaim 17, wherein the first PCM portion is the same as the second PCMportion.
 19. The thermal transfer device of claim 17, wherein the firstPCM container is fastenable to the first pillar and the second PCMcontainer is fastenable to the third pillar.
 20. The thermal transferdevice of claim 19, wherein the second PCM container includes one ormore pivotable locks, the third pillar includes one or more cutoutssized and positioned to accept the one or more pivotable locks in amanner that pivoting f corresponding ones of the one or more pivotablelocks fastens or unfastens the second PCM container relative to thethird panel.
 21. The thermal transfer device of claim 1, wherein the atleast one PCM carrier is removably positioned in a space defined by thefirst and second pillars.
 22. The thermal transfer device of claim 21,wherein the at least one PCM carrier is magnetically securable to thehousing.
 23. The thermal transfer device of claim 1, wherein the atleast one PCM carrier includes a first PCM carrier compartment and asecond PCM carrier compartment, and wherein the at least one second PCMincludes two or more PCM containers positioned inside the first andsecond PCM carrier compartments, respectively.
 24. The thermal transferdevice of claim 23, wherein the two or more PCM containers are sized andconfigured to removably fit inside the first and second PCM carriercompartments.
 25. The thermal transfer device of claim 23, wherein eachof the first PCM carrier compartment and the second PCM carriercompartment is defined by exterior walls and one or more interior walls.26. The thermal transfer device of claim 25, wherein at least one of theexterior walls include one or more notches or openings extendingtherethrough.
 27. The thermal transfer device of claim 25, wherein theat least one PCM carrier includes a flexible handle attached to at leastone of the exterior walls thereof.
 28. The thermal transfer device ofclaim 1, wherein the top plate is positioned substantially in a firstplane, the first pillar is positioned substantially in a second planethat is substantially perpendicular to the first plane, and the secondpillar is positioned substantially in a third plane that issubstantially parallel to the second plane.
 29. A temperature-stabilizedcontainer, comprising: at least one first wall defining a storage space;at least one second wall spaced outwardly from the at least one firstwall and defining an insulation space therebetween; a thermal transferdevice including a first portion positioned inside the storage space,and a second portion positioned outside the storage space, the thermaltransfer device including: a housing including, a top plate; a firstpillar extending from the top plate, the first pillar being positionedinside the storage space; and a second pillar extending from the topplate, the second pillar being positioned inside the storage space; atleast one phase change material (PCM) carrier containing at least onesecond PCM and being in thermal communication with one or more of thefirst pillar or the second pillar, the at least one PCM carrier beingpositioned inside the storage space; and a heat pipe having a firstthermal end thereof in thermal communication with one or more of the topplate, the first pillar, or the second pillar.
 30. Thetemperature-stabilized container of claim 29, wherein the thermaltransfer device includes a base plate spaced from the top plate and fromwhich the first and second pillars extend.
 31. Thetemperature-stabilized container of claim 30, wherein the base plate ofthe thermal transfer device is attached to the first pillar and secondpillar and positioned generally opposite to the top plate.
 32. Thetemperature-stabilized container of claim 29, herein the second pillarof the thermal transfer device includes a first pillar portion and asecond pillar portion connected together.
 33. The temperature-stabilizedcontainer of claim 32, wherein the heat pipe of the thermal transferdevice is positioned between and secured in thermal communication to thefirst and second pillar portions.
 34. The temperature-stabilizedcontainer of claim 29, wherein the heat pipe includes a second thermalend in thermal communication with one or more of a cooling unit or aheating unit.
 35. The temperature-stabilized container of claim 34,wherein the second thermal end of the heat pipe is in thermalcommunication with a thermoelectric cooler (TEC) configured to cool thesecond thermal end of the heat pipe.
 36. The temperature-stabilizedcontainer of claim 35, wherein the TEC includes a cold side in thermalcommunication with the second end of the heat pipe and a hot side inthermal communication with one or more secondary heat pipes at firstthermal ends thereof.
 37. The temperature-stabilized container of claim35, wherein the TEC is positioned outside of the storage chamber. 38.The temperature-stabilized container of claim 35, further including anelectronic controller operably coupled to the TEC and configured tocontrol operation of the TEC.
 39. The temperature-stabilized containerof claim 36, wherein the one or more secondary heat pipes include secondends in thermal communication with one or more heat sinks.
 40. Thetemperature-stabilized container of claim 39, further including one ormore fans positioned to produce fluid flow across the one or more heatsinks.
 41. The temperature-stabilized container of claim 39, furtherincluding a cover at least partially enclosing the one or more heatsinks.
 42. The temperature-stabilized container of claim 41, wherein thecover includes one or more vent openings sized and configured to allowair flow to the one or more heat sinks or from the one or more heatsinks.
 43. The temperature-stabilized container of claim 29, furtherincluding at least one PCM container containing at least one first PCMand being in thermal communication with the first pillar of the housing,the at least one PCM container being positioned inside the storagespace.
 44. The temperature-stabilized container of claim 43, wherein theat least one first PCM is substantially the same as the at least onesecond PCM.
 45. The temperature-stabilized container of claim 43,wherein the at least one first PCM is different from the at least onesecond PCM.
 46. The temperature-stabilized container of claim 43,wherein the at least one PCM container is fastened to the first pillar.47. The temperature-stabilized container of claim 46, wherein the atleast one PCM container includes one or more pivotable locks, the firstpillar includes one or more cutouts sized and positioned to acceptcorresponding ones of the one or more pivotable locks in a manner thatpivoting of the one or more pivotable locks fastens or unfastens the atleast one PCM container relative to the first
 48. Thetemperature-stabilized container of claim 29, wherein the housingincludes a third pillar extending from the top plate, the second pillarbeing positioned between the first pillar and the third panel.
 49. Thetemperature-stabilized container of claim 43, wherein the at least onefirst PCM includes first and second PCM portions, and wherein the atleast one PCM container includes a first PCM container containing thefirst PCM portion in thermal communication with the first pillar and asecond PCM container containing the second PCM portion in thermalcommunication with the third pillar.
 50. The temperature-stabilizedcontainer of claim 49, wherein the first PCM portion is the same as thesecond. PCM portion.
 51. The temperature-stabilized container of claim49, wherein the second PCM container is fastened to a third pillarextending from the top plate.
 52. The temperature-stabilized containerof claim 51,herein the second PCM container includes one or morepivotable locks, the third pillar includes one or more cutouts sized andpositioned to accept the one or more pivotable locks in a manner thatpivoting of corresponding ones of the one or more pivotable locksfastens or unfastens the second PCM container relative to the thirdpanel.
 53. The temperature-stabilized container of claim 29, wherein theat least one PCM carrier is removably positioned in a space defined bythe first and second pillars.
 54. The temperature-stabilized containerof claim, wherein the at least one PCM carrier is magnetically securedto the housing.
 55. The temperature-stabilized container of claim 29,wherein the at least one PCM carrier includes a first PCM carriercompartment and a second PCM carrier compartment, and wherein the atleast one second PCM includes two or more PCM containers positionedinside the first and second PCM carrier compartments, respectively. 56.The temperature-stabilized container of claim 55, wherein the two ormore PCM containers are sized and configured to removably fit inside thefirst and second PCM carrier compartments.
 57. Thetemperature-stabilized container of claim 55, wherein each of the firstPCM carrier compartment and the second. PCM carrier compartment isdefined by exterior walls and one or more interior walls.
 58. Thetemperature-stabilized container of claim 57, wherein the exterior wallsof the at least one PCM carrier include one or more notches or openingsextending therethrough.
 59. The temperature-stabilized container ofclaim 57, wherein the at least one PCM carrier includes a flexiblehandle attached to at least one of the exterior walls thereof.
 60. Thetemperature-stabilized container of claim 29, wherein the top plate ispositioned substantially in a first plane, the first pillar ispositioned substantially in a second plane that is substantiallyperpendicular to the first plane, and the second pillar is positionedsubstantially in a third plane that is substantially parallel to thesecond plane.
 61. A method of maintaining a temperature in a closedstorage space, the method comprising: providing a temperature-stabilizedcontainer that includes, a shell defining a storage space; a thermaltransfer device positioned inside the storage space, the thermaltransfer device including, a top plate; a first pillar extending fromthe top plate, the first pillar being positioned inside the storagespace; and a second pillar extending from the top plate, the secondpillar being positioned inside the storage space; at least one phasechange material (PCM) container containing at least one first PCM andbeing in thermal communication with the first pillar of the housing, theat least one PCM container being positioned inside the storage space; atleast one PCM carrier containing at least one second PCM and being inthermal communication with one or more of the first pillar or the secondpillar, the at least one PCM carrier being positioned inside the storagespace; and a heat pipe having a first thermal end thereof in thermalcommunication with one or more of the top plate, the first pillar or thesecond pillar; and removing heat from the storage space by cooling asecond thermal end of the heat pipe to produce heat transfer from the atleast one first PCM and the at least one second PCM to the second end ofheat pipe.
 62. The method of claim 61, further including maintaining aselected temperature or a temperature range inside the storage space by:measuring one or more of temperature inside the storage space,temperature of the at least one first or at least one second PCM, amountof the at least one first or at least one second PCM in a solid phase,or amount of the at least one first or at least one second PCM in aliquid phase; and via a controller, operating a cooling device inthermal communication with the second thermal end of the heat pipe tocool the storage space to a selected temperature at least partiallybased on one or more of the measured temperature inside the storagespace, temperature of the at least one first or at least one second PCM,amount of the at least one first or at least one second PCM in a solidphase, or amount of the first or at least one second PCM in a liquidphase.
 63. The method of claim 62, wherein the cooling device includesthermoelectric cooler (TEC).
 64. The method of claim 63, furtherincluding cooling a hot side of the TEC.
 65. The method of claim 64,further including channeling heat from the hot side of the TEC to one ormore heat sinks.
 66. The method of claim 65, further including flowingair over the one or more heat sinks effective to remove heat therefrom.